Electromagnetic interference shielding, mechanical properties and water absorption of copper/bamboo fabric (Cu/BF) composites

Copper/bamboo fabric (Cu/BF) composites were prepared by electroless deposition via a tin-free process. The process involved 3-aminopropyltrimethoxysilane modification, noble metal (Au or Pd) activation and electroless copper planting of BF. The copper deposition rate via Pd catalytic process was 1.01 mg/cm2 h, higher than that by Au catalytic process (0.85 mg/cm2 h). The microstructure of Cu/BF composites was analyzed by scanning electron microscopy (SEM), and the copper coatings were composed of ball-shaped copper particles. The composition and chemical state of copper layers were measured by X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS) spectra, Cu0 was detected but copper dioxide was not found in both spectra. The electromagnetic interference, water absorption, mechanical tension, conductivity and adhesion properties of Cu/BF samples (weight ratio of Cu/BF: 0.36 ± 0.01) were measured to obtain the qualities of the composites.