Thermal Vacuum Deposition of Transparent Conductive Layers on Semiconductor Electrode Tools for Electrochemical Machining of Engineering Products

This paper proposes a novel process for electrochemical engraving of metals without a need for stencils and photolithography. It dwells upon the features of receptions of electrodeposition films on a semiconductor tool electrode for electrochemical machining. The analytical equations to calculate the necessary thickness of a film are obtained. The technique of drawing films by thermal transpiration on vacuum plant VUP-4 is observed. The authors study a technology of making and designing the photo-active electrode tool, based on Cu/Si structure. The electrical and optical properties of a semiconductor thin plate have been investigated. The paper analyses the results of electrochemical machining by electrode tools with various thickness of an electrodeposition film. The theory and method of making, experimental results and an application of the semiconductor tool electrode are presented in this paper.