Drop Test and Finite Element Analysis of Test Board

Most electronic components have high precision and expensive features and people used the drop test to determine the reliability of these electronic components effectively. This study focused on the drop test of FR-4 test board according to the JEDEC standard, to understand the test board's basic mechanical properties and variations of stress and strain on test board. This study used finite element analysis software ANSYS/LS-DYNA to perform a drop test simulation of test board under JESD22-B111 standard, with 0.5ms pulse duration time and 1500G peak acceleration as test conditions. The support excitation method was used to predict the test board response during impact. The results between full model and quarter model were compared to verify the accuracy and efficiency of finite element analysis.