A Study on Pore-forming Agent in the Resin Bond Diamond Wheel Used for Silicon Wafer Back-grinding

Thinner thickness of the subsurface damage (SSD) layer and lower surface roughness of the grinded silicon wafers should be required, which would depend on high self-sharpening ability and consistent performance of the resin bond diamond wheel used in back-grinding. In this paper application of the pore-forming agent for improving these properties of the grinding wheel was experimentally studied. The bonding strength and the grinding performance of the resin-bond diamond wheel affected by the pore-forming agent were evaluated by testing.