Multi-level deformation of thin films caused by stress–strain distribution at the film-substrate interface

The processes of elastic deformation of thin films on substrates under thermal and mechanical loadings were investigated. Mechanisms of formation of wrinkle and buckle patterns on the surfaces of metal and oxide films are studied. It is demonstrated that important role is played by the periodical distribution of stresses and strains at the film-substrate interface underlying the deformation of thin films subjected to different external loadings.