کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
9567233 1503711 2005 8 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Electronic process of Cu(Ag, V, Rh)(0 0 1) surface oxidation: atomic valence evolution and bonding kinetics
موضوعات مرتبط
مهندسی و علوم پایه شیمی شیمی تئوریک و عملی
پیش نمایش صفحه اول مقاله
Electronic process of Cu(Ag, V, Rh)(0 0 1) surface oxidation: atomic valence evolution and bonding kinetics
چکیده انگلیسی
The electronic processes of Cu(Ag, V, Rh)(0 0 1) surface oxidation are comparatively analyzed based on the recent 'chemical bond-valence band-potential barrier' (BBB) correlation mechanism [C.Q. Sun, Prog. Mater. Sci. 48, 521-685 (2003)], which allows reaction formulae for all the observed phases with identification of individual atomic valence and the binding kinetics at the surfaces with the same geometry. It is consistently understood that the forming kinetics of the primary oxide tetrahedron and its derivative on the valence density-of-states (DOS) are intrinsically common for all these analyzed systems, though the patterns of observation in terms of morphology and crystallography vary from situation to situation. However, the lattice size and electronegativity of the host surfaces determine extrinsically the site selectivity of the oxygen, the order of bond formation and the orientation of the oxide tetrahedron.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Surface Science - Volume 246, Issues 1–3, 15 June 2005, Pages 6-13
نویسندگان
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