Silicon microstructure fabricated by laser micro-patterning method combined with wet etching process

A simple method for silicon microfabrication has been successfully developed. Polypropylene (PP) film as a resist was prepared on a surface of silicon (Si) (1 0 0) plate by an rf magnetron sputtering method. A pulsed laser light was focused and irradiated to the PP film and a part of the film was removed by laser ablation process in the spot at certain laser intensity. When the sample was immersed in a potassium hydroxide solution, etching occurred only at the part that the PP film was removed by laser ablation. These results raise the possibility of this method as a process for Si microfabrication.