کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
9572488 | 1503715 | 2005 | 5 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Synchrotron radiation stimulated etching SiO2 thin films with a contact cobalt mask
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
موضوعات مرتبط
مهندسی و علوم پایه
شیمی
شیمی تئوریک و عملی
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Synchrotron radiation stimulated etching SiO2 thin films with a contact cobalt mask Synchrotron radiation stimulated etching SiO2 thin films with a contact cobalt mask](/preview/png/9572488.png)
چکیده انگلیسی
Patterning SiO2 thin film on the Si (1Â 0Â 0) surface was demonstrated by synchrotron radiation (SR) stimulated etching with a contact cobalt mask. The reaction gas was a mixture of SF6 and O2. The contact cobalt mask was fabricated by sputtering cobalt films on a photolithography resist pattern and lift-off technique. The thickness of the mask was about 145Â nm. The SR irradiation with flowing SF6 and O2 could effectively etch the silicon dioxide and the etching process stopped at the SiO2/Si interface. The etching rate at room temperature was about 2.7Â nm per 100Â mAÂ min. The etched pattern was evaluated by scanning electron microscopy (SEM), atomic force microscopy (AFM) and step profile meter. Area-selective and anisotropy etching were achieved and the roughness (Ra) with a line profile on the etched surface was about 0.05Â nm.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Surface Science - Volume 242, Issues 3â4, 15 April 2005, Pages 276-280
Journal: Applied Surface Science - Volume 242, Issues 3â4, 15 April 2005, Pages 276-280
نویسندگان
Changshun Wang, Tsuneo Urisu,