کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
9672256 | 1450565 | 2005 | 7 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Reliability study of new SnZnAl lead-free solders used in CSP packages
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
پیش نمایش صفحه اول مقاله

چکیده انگلیسی
We further mounted SnZnAl solder balls onto Cu/Ni(nickel)/Au(gold) plated polyimide substrate at a joining temperature of 215 °C for CSP applications. It was confirmed that the joint interface between soldered ball and substrate at the initial stage was made of 2-layered compounds, i.e., AuZnSn on soldered side and ZnSnNi on substrate side. After 1000 h aging at 150 °C, the two layers compounds become one layer of ZnSnNiAu compound. No strength deterioration of Cu/Ni/Au/SnZnAl after the 1300 h shelf test was detected in the ball shear strength compared with the initial value. This paper describes the characteristics of the new lead-free solder and the results of a study on its solder ball CSP package.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 45, Issues 7â8, JulyâAugust 2005, Pages 1208-1214
Journal: Microelectronics Reliability - Volume 45, Issues 7â8, JulyâAugust 2005, Pages 1208-1214
نویسندگان
Masayuki Kitajima, Tadaaki Shono,