کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
9795878 | 1514936 | 2005 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
A comparison of microstructural developments in TLP diffusion bonds made using ODS Ni alloy
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
دانش مواد (عمومی)
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
The presence of a dispersion of Y2O3 particles and an elongated grain structure with an aspect ratio of greater than 5 gives oxide dispersion strengthened alloys excellent creep properties at elevated temperatures. Therefore, when engineering components are fabricated using ODS alloys, consideration must be given to the joining technique used during manufacture. In this study, a diffusion bonding technique is used to join a Ni-based ODS alloy, MA 758, using two different metal interlayers. The research investigates the effect of interlayer composition, bonding time and the use of post-bond heat treatments on compositional and microstructural homogeneity of the joint region. The influences of parent alloy grain size were found to be significant on the diffusion bonding process using both Ni-Cr-Fe-B-Si and Ni-P interlayers. Diffusion of elements from the parent alloy into the liquid interlayer has a significant effect on the rate of isothermal solidification when using Ni-P interlayers.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Science and Engineering: A - Volume 406, Issues 1â2, 15 October 2005, Pages 319-327
Journal: Materials Science and Engineering: A - Volume 406, Issues 1â2, 15 October 2005, Pages 319-327
نویسندگان
R.K. Saha, S. Wei, T.I. Khan,