کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
9821576 | 1518988 | 2005 | 5 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Ion implantation as a pre-treatment method of AlN substrate for direct bonding with copper
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
سطوح، پوششها و فیلمها
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چکیده انگلیسی
Ion implantation was examined as a pre-treatment procedure for AlN substrates used for direct bonding with Cu. It replaces the conventional process of thermal oxidation. Ti, Fe and O ions were used at acceleration voltages of 15 and 70Â kV in the dose range between 1016 and 1018Â ions/cm2. Shear strength measurements of the prepared joints have shown that the optimum results are obtained for Ti implanted at 15Â kV to a dose of 5Ã1016Â ions/cm2. The bond strength attained for such conditions exceeds that of conventionally prepared joints by a factor of 5. The morphology of fractured joints was studied by SEM and discussed in terms of changes induced by the implanted ions.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Vacuum - Volume 78, Issues 2â4, 30 May 2005, Pages 205-209
Journal: Vacuum - Volume 78, Issues 2â4, 30 May 2005, Pages 205-209
نویسندگان
M. Barlak, W. OlesiÅska, J. Piekoszewski, M. Chmielewski, J. Jagielski, D. KaliÅski, Z. Werner, B. Sartowska,