کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
9845201 | 1526509 | 2005 | 8 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Front-End electronics and integration of ATLAS pixel modules
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
فیزیک و نجوم
ابزار دقیق
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
For the ATLAS Pixel Detector fast readout electronics has been successfully developed and tested. Main attention was given to the ability to detect small charges in the order of 5,000 eâ within 25 ns in the harsh radiation environment of LHC together with the challenge to cope with the huge amount of data generated by the 80 million channels of the Pixel detector. For the integration of the 50 μm pitch hybrid pixel detector, reliable bump bonding techniques using either lead-tin or indium bumps has been developed and has been successfully tested for large-scale production.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment - Volume 549, Issues 1â3, 1 September 2005, Pages 157-164
Journal: Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment - Volume 549, Issues 1â3, 1 September 2005, Pages 157-164
نویسندگان
F. Hügging, on behalf of the ATLAS Pixel Collaboration on behalf of the ATLAS Pixel Collaboration,