Thermal analysis for step and flash imprint lithography during UV curing process Fulltext Access 5 Pages 2006
Diffusion barrier performance of W/Ta–W–N double layers for Cu metallization Fulltext Access 5 Pages 2006
Fabrication of multi-dimensional colloid crystals on raised surfaces via reversal nanoimprint lithography Fulltext Access 5 Pages 2006
Analysis of HSG-7000 silsesquioxane-based low-k dielectric hot plate curing using Raman spectroscopy Fulltext Access 5 Pages 2006
Effect of the spatial distribution of SiO2 thickness on the switching behavior of bistable MOS tunnel structures Fulltext Access 5 Pages 2006
Determination of swing curve “shifts” as a function of illumination conditions: Impact on the CD uniformity Fulltext Access 5 Pages 2006
Fabrication of nano-sized resist patterns on flexible plastic film using thermal curing nano-imprint lithography Fulltext Access 5 Pages 2006
Inkjet printed silver source/drain electrodes for low-cost polymer thin film transistors Fulltext Access 5 Pages 2006
Study of ultrathin vanadium nitride as diffusion barrier for copper interconnect Fulltext Access 5 Pages 2006
Fabrication of various curved relief structures through concave surface forming and soft replica molding Fulltext Access 5 Pages 2006
Frequency dependent capacitance and conductance–voltage characteristics of Al/Si3N4/p-Si(1 0 0) MIS diodes Fulltext Access 5 Pages 2006
Fabrication of PDMS (polydimethylsiloxane) microlens and diffuser using replica molding Fulltext Access 5 Pages 2006
Vertically aligned GaN nanotubes – Fabrication and current image analysis Fulltext Access 5 Pages 2006
Template synthesis of carbon nanotubes from porous alumina matrix on silicon Fulltext Access 5 Pages 2006
Capacitance non-linearity study in Al2O3 MIM capacitors using an ionic polarization model Fulltext Access 5 Pages 2006
Electrical properties and thermal stability of MOCVD grown Ru gate electrodes for advanced CMOS technology Fulltext Access 5 Pages 2006
Material and electrical characterization of TMS-based silicidation of the Cu-dielectric barrier interface for electromigration improvement of 65 nm interconnects Fulltext Access 5 Pages 2006
Reliability issues in Cu/low-k structures regarding the initiation of stress-voiding or crack failure Fulltext Access 5 Pages 2006
Effects of electromigration on microstructural evolution of eutectic SnPb flip chip solder bumps Fulltext Access 5 Pages 2006
Deposition of photocatalytic TiO2 layers by pulse magnetron sputtering and by plasma-activated evaporation Fulltext Access 5 Pages 2006
Investigation of interfacial structure of Mg/Al vacuum diffusion-bonded joint Fulltext Access 5 Pages 2006
Effect of AlN layer thickness on structure and magnetic properties of FePt/AlN multilayers Fulltext Access 5 Pages 2006
New approaches to fabrication of multilayer Fresnel zone plate for high-energy synchrotron radiation X-rays Fulltext Access 5 Pages 2006
Electrochemical studies of nano-structured diamond thin-film electrodes grown by microwave plasma CVD Fulltext Access 5 Pages 2006
Effects of substrate temperature on tin-doped indium oxide films deposited by dc arc discharge ion plating Fulltext Access 5 Pages 2006
Experimental and numerical investigation of ion temperature in an ECR plasma Fulltext Access 5 Pages 2006
Studies on p-type copper (I) selenide crystalline thin films for hetero-junction solar cells Fulltext Access 5 Pages 2006
Effects of nozzle shape on the interruption performance of thermal puffer-type gas circuit breakers Fulltext Access 5 Pages 2006
Control of macrostress σ in reactively sputtered Mo–Al–N films by total gas pressure Fulltext Access 5 Pages 2006
Grid emission suppression characteristics of molybdenum grids coated with Hf and Pt films Fulltext Access 5 Pages 2006
Future energy supply for society—Challenges in evaluation criteria and interdisciplinary research Fulltext Access 5 Pages 2006
Optical properties of magnesium aluminate spinel crystals implanted with helium ions Fulltext Access 5 Pages 2006
Calculation of neutral fraction for ion neutralization at metal surfaces by bulk-plasmon excitation Fulltext Access 5 Pages 2006
On the profile of temperature dependent series resistance in Al/Si3N4/p-Si (MIS) Schottky diodes Fulltext Access 5 Pages 2006
Multibeam electron source for nanofabrication using electron beam induced deposition Fulltext Access 5 Pages 2006
Phase effects and short gate length device implementation of Ni fully silicided (FUSI) gates Fulltext Access 5 Pages 2006
Different approaches to integrate patterned buried CoSi2 layers in SOI substrates Fulltext Access 5 Pages 2006
Density functional study of the stability and electronic properties of TaxNy compounds used as copper diffusion barriers Fulltext Access 5 Pages 2006
Dependence of CMP-induced delamination on number of low-k dielectric films stacked Fulltext Access 5 Pages 2006
Characterization of imprinting polymeric temperature variation with fluorescent Rhodamine B molecule Fulltext Access 5 Pages 2006
Nanoscale imaging with a portable field emission scanning electron microscope Fulltext Access 5 Pages 2006
Transitioning of direct e-beam write technology from research and development into production flow Fulltext Access 5 Pages 2006
Optical properties of cubic SiC grown on Si substrate by chemical vapor deposition Fulltext Access 5 Pages 2006
Device processing and characterisation of high temperature silicon carbide Schottky diodes Fulltext Access 5 Pages 2006
Growth of Ru/RuO2 layers with atomic vapor deposition on plain wafers and into trench structures Fulltext Access 5 Pages 2006
Influence of mass density and mechanical properties on the surface acoustic wave velocity dispersion Fulltext Access 5 Pages 2006
Properties of 50 nm electroless films Ag–W–oxygen before and after low temperature, low activation energy resistivity decay Fulltext Access 5 Pages 2006
Measuring the Young’s modulus of ultralow-k materials with the non destructive picosecond ultrasonic method Fulltext Access 5 Pages 2006
High frequencies characterization of Cu-MIM capacitors in parallel configuration for advanced integrated circuits Fulltext Access 5 Pages 2006
Evaluation of air gap structures produced by wet etch of sacrificial dielectrics: Extraction of keff for different technology nodes and film permittivity Fulltext Access 5 Pages 2006
Study of the post-etch cleaning compatibility with dense and porous ULK materials – characterization of the process impact Fulltext Access 5 Pages 2006
Characterization of the impact of plasma treatments and wet cleaning on a porous low k material Fulltext Access 5 Pages 2006
Chemical etching solutions for air gap formation using a sacrificial oxide/polymer approach Fulltext Access 5 Pages 2006
Impact of dummies on interconnects network HF propagation performances for the 65 nm node Fulltext Access 5 Pages 2006
Quantification of processing damage in porous low dielectric constant films Fulltext Access 5 Pages 2006
Tuning nickel silicide properties using a lamp based RTA, a heat conduction based RTA or a furnace anneal Fulltext Access 5 Pages 2006
Electrical properties of epitaxial NiSi2/Si contacts with extremely flat interface formed in Ni/Ti/Si(0 0 1) system Fulltext Access 5 Pages 2006
In situ study of the growth kinetics and interfacial roughness during the first stages of nickel–silicide formation Fulltext Access 5 Pages 2006
Microstructure and material properties of electroless CoWP films obtained from sulfamate solutions Fulltext Access 5 Pages 2006
CMP characteristics and optical property of ITO thin film by using silica slurry with a variety of process parameters Fulltext Access 5 Pages 2006
Chip-to-chip interconnections based on the wireless capacitive coupling for 3D integration Fulltext Access 5 Pages 2006
Wide band frequency and in situ characterisation of high permittivity insulators (High-K) for H.F. integrated passives Fulltext Access 5 Pages 2006
Correlation between trench depth and TDDB thermal activation energy in single damascene Cu/SiOC:H Fulltext Access 5 Pages 2006