Electrochemical studies of Pd-doped Cu and Pd-doped Cu-Al intermetallics for understanding corrosion behavior in wire-bonding packages
Keywords: HAST; high accelerated stress testing; IMC; intermetallic compound; Eoc; open circuit potential; icorr; corrosion current density; XRD; X-ray diffraction; FAB; free air ball; WE; working electrode; RE; reference electrode; CE; counter electrode; Rsoln; so