Keywords: مواد کم کم; Low-k materials; Porosity; EELS; Kramers–Kronig relations; Dielectric function
مقالات ISI مواد کم کم (ترجمه نشده)
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Theoretical investigation of in situ k-restore processes for damaged ultra-low-k dielectrics
Keywords: مواد کم کم; k-Restore; Low-k materials; DFT; MD; Plasma repair
Probing the microporosity of low-k organosilica films: MP and t-plot methods applied to ellipsometric porosimetry data
Keywords: مواد کم کم; Low-k materials; Porous organosilica; Ellipsometric porosimetry; Molecular simulation
The effects of UV radiation on SiC(O)N/SiOC(− H) thin films grown on Si substrates using plasma-enhanced atomic layer deposition
Keywords: مواد کم کم; Low-k materials; SiC(O)N; SiOC(− H) films; PEALD; etch stop layer; mechanical properties
Spectroscopic and capacitance-voltage characterization of thin aminopropylmethoxysilane films doped with copper phthalocyanine, tris(dimethylvinylsilyloxy)-POSS and fullerene cages
Keywords: مواد کم کم; X-ray photoelectron spectroscopy; Capacitance-voltage characterization; 3-Aminopropyltrimethoxysilane; Low-k materials;
The influence of N containing plasmas on low-k films
Keywords: مواد کم کم; Low-k materials; Plasma damage
Ultraviolet irradiation effect on the properties of leakage current and dielectric breakdown of low-dielectric-constant SiOC(H) films using comb capacitor structure
Keywords: مواد کم کم; Low-k materials; SiOC(H) film; PECVD; UV irradiation; FTIR
UV irradiation effects on the bonding structure and electrical properties of ultra low-k SiOC(–H) thin films for 45 nm technology node
Keywords: مواد کم کم; Low-k materials; SiOC(–H) film; PECVD; UV irradiation; FT-IR
One-step fabrication of ultralow dielectric polyimide films consisting of size-controlled mesoporous nanoparticles
Keywords: مواد کم کم; Mesoporous nanoparticles; Polyimide; Solvent evaporation induced self-assembly; Low-k materials
Study of Cu diffusion behavior in low dielectric constant SiOC(–H) films deposited by plasma-enhanced chemical vapor deposition
Keywords: مواد کم کم; Low-k materials; SiOC(–H) films; PECVD; Bias temperature stress; Cu metallization; C–V; AES; TEM
Effect of evaporated copper and aluminum on post-annealed SiOC(–H) films deposited using plasma-enhanced chemical vapor deposition
Keywords: مواد کم کم; Low-k materials; SiOC(–H) films; PECVD; Electric field stress; C–V; Trapping
Capacitance measurements and k-value extractions of low-k films
Keywords: مواد کم کم; Back contact; Capacitance; Dielectric films; k-Value; Leakage; Low-k materials; Ohmic contacts; Water uptake
Optical emission diagnostics of etching of low-k dielectrics in a two frequency inductively coupled plasma
Keywords: مواد کم کم; Low-k materials; Plasma etching; Inductively coupled plasmas
Mechanical characterization of zeolite low dielectric constant thin films by nanoindentation
Keywords: مواد کم کم; Nanoindentation; Mechanical properties; Low-k materials; Spin-on zeolites
Irradiation-induced damage in porous low-k materials during low-energy heavy-ion elastic recoil detection analysis
Keywords: مواد کم کم; 82.80.Yc; 61.80.Jh; 61.82.Pv; 87.64.JeElastic recoil detection; Irradiation damage; Elemental loss; Low-k materials; FTIR
Investigation of a-C:F films as hydrogenated diamond-like carbon and low-k materials
Keywords: مواد کم کم; 52.25.Mq; 71.23.âk; Low-k materials; a-C:F films; Diamond-like carbon; Resonance effect; Inductive effect; Diels-Alder reaction;
Low-dielectric, nanoporous polyimide films prepared from PEO-POSS nanoparticles
Keywords: مواد کم کم; Low-k materials; Nanoparticles; Polyimide;