کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
10156052 | 1666370 | 2019 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
The wetting phenomenon and precursor film characteristics of Sn-37Pb/Cu under ultrasonic fields
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: The wetting phenomenon and precursor film characteristics of Sn-37Pb/Cu under ultrasonic fields The wetting phenomenon and precursor film characteristics of Sn-37Pb/Cu under ultrasonic fields](/preview/png/10156052.png)
چکیده انگلیسی
The wetting phenomenon of Sn-37Pb alloy solder spreading on Cu substrate under different ultrasonic fields was investigated. Sn-37Pb/Cu wetting systems showed significant precursor film characteristics with the assist of ultrasonic energy. A short-time ultrasonic field evidently enhanced the wettability of Sn-37Pb/Cu compare to a common wetting field which had no introduced ultrasonic. At the temperature of 213â¯Â°C, spreading area of a Sn-37Pb solder drop in a 20â¯kHz, 1000â¯W ultrasonic field reached maximum at 2â¯s, and showed significant precursor film characteristics. Atomistic dynamic models showed the relevance between wettability and precursor film formation. The observed dynamic results agreed with the experimental results.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Letters - Volume 234, 1 January 2019, Pages 92-95
Journal: Materials Letters - Volume 234, 1 January 2019, Pages 92-95
نویسندگان
Yao Yang, Shaorong Li, Yuxin Liang, Bangsheng Li,