Raman spectroscopic assessments of structural orientation and residual stress in wurtzitic AlN film deposited on (0Â 0Â 1) Si

In this paper, polarized Raman spectroscopy is applied to quantitatively assess crystallographic alteration and interfacial residual stress with a micron-scale resolution in highly 〈0 0 0 1〉 oriented (textured) polycrystalline wurtzitic AlN films grown on (0 0 1)-oriented Si substrates. Raman selection rules for the wurtzite structure of AlN were explicitly put forward and a set of Raman tensor elements determined from experimentally retrieved angular dependences of Raman band intensities upon in-plane rotation measurements. An appreciably high degree of homogeneity in the AlN film (i.e., with respect to both in-plane and out-of-plane Euler angles, retrieved according to the proposed spectroscopic algorithm) could be observed in spectral line scans randomly selected on the cross-section of the film/substrate system. These characterizations indicated negligible structural alterations, such as grain tilting and twisting during film growth. However, a non-uniform stress distribution in the AlN film along the film thickness direction was found, which remained stored during manufacturing of the AlN film. A quite remarkable magnitude of compressive residual stress (∼−1.5 GPa) could be measured at the film/substrate interface. Finally, a Raman (non-destructive) statistical characterization of the film system in terms of micromechanical homogeneity by spectral surface mapping is presented, which provides a prompt overall view of the film quality. The proposed procedure should generally be applicable in crystallographic and micromechanical quality control of electronic film devices exhibiting a Raman spectrum.