کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
10365495 872100 2005 5 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Anodic bonding of glass and silicon wafers with an intermediate silicon nitride film and its application to batch fabrication of SPM tip arrays
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Anodic bonding of glass and silicon wafers with an intermediate silicon nitride film and its application to batch fabrication of SPM tip arrays
چکیده انگلیسی
This paper reports a detailed study of wafer-level anodic bonding with a dielectric intermediate layer and its application to the fabrication of scanning probe microscope (SPM) probe arrays. First, the bonding performance between sodium-ion rich glass and silicon nitride coated silicon substrate is characterized. The effects of voltage, tool pressure, bonding time, surface properties, and cleanliness are thoroughly studied. Then, the silicon nitride based SPM probe arrays consisted of pyramidal tip and 1.5 μm-thickness cantilever are successful bonded and transferred to Pyrex 7740 glass substrate by use of our optimized wafer-scale electrostatic force bonding condition. The nano-imaging capability of the scanning probe array is also demonstrated.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Journal - Volume 36, Issue 7, July 2005, Pages 678-682
نویسندگان
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