An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler

- The reliability properties of solderable ICA interconnections were investigated.
- The metallurgically-interconnected solderable ICA show good electrical reliability.
- The interfacial IMC layers were transformed from scallop-type to layer-type IMC.
- The fracture surface showed a semi-brittle fracture mode.
- Solderable ICA can achieve excellent electrical/mechanical reliability properties.