Thermal modelling of the multi-stage heating system with variable boundary conditions in the wafer based precision glass moulding process

► Thermal modelling of heating system in wafer based glass moulding was carried out. ► Radition from the interior of the glass palys an important role for thick wafers. ► The glass-mould contact heat transfer coefficient was determined. ► Temperature distribution in the glass wafer was calculated by three dimensional FE model. ► The criterion of temperature uniformity in the wafer for start of the moulding was evaluated.