کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
10419554 904215 2005 8 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Understanding simultaneous double-disk grinding: operation principle and material removal kinematics in silicon wafer planarization
موضوعات مرتبط
مهندسی و علوم پایه سایر رشته های مهندسی مهندسی صنعتی و تولید
پیش نمایش صفحه اول مقاله
Understanding simultaneous double-disk grinding: operation principle and material removal kinematics in silicon wafer planarization
چکیده انگلیسی
Simultaneous double-disk grinding (DDG) is a novel and powerful technology for precision-machining mono-crystalline silicon slices (“wafers”). With DDG the extreme degrees of planarity can be achieved, which the fabrication of micro-electronic devices with minimum lateral feature dimensions of 90 nm and below demands. In DDG, both sides of the wafer are ground simultaneously between two opposite grinding wheels on collinear spindle axes. It is a chuck-less process, in which the workpiece is machined in “free-floating” fashion. Machining kinematics, removal mechanism, and resulting wafer shape differ from those known from (chuck-mounted) single-side grinding or double-sided batch lapping, which are conventionally used in mechanical wafer shaping. This article explains the kinematics of DDG and derives the basic, method-inherent features always observed on DDG-ground wafers from simple kinematic considerations without further model assumptions: global wafer shape, center dip (“navel”), edge thickness roll-off, and symmetries. The expected results are compared with experimental data.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Precision Engineering - Volume 29, Issue 2, April 2005, Pages 189-196
نویسندگان
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