Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing (CMP) processes

► We propose a material removal rate (MRR) distribution model for SiO2 CMP. ► Contact mechanics are used for modeling the average MRR of SiO2 film. ► A spatial parameter for MRR distribution is obtained from semi-empirical study. ► The MRR distribution model consists of the average MRR and spatial parameter. ► The proposed model includes the newly proposed line density of particles.