Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Semiconductor fabrication; Chemical mechanical polishing (CMP); Polishing pad; Diamond conditioner;
مقالات ISI ماشینکاری مکانیکی شیمیایی (CMP) (ترجمه نشده)
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Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); Silicon carbide; Silica particles; Ionic strength; Zeta potential; X-ray photoelectron spectroscopy;
Atomistic mechanisms of Cu CMP in aqueous H2O2: Molecular dynamics simulations using ReaxFF reactive force field
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Copper; Chemical mechanical polishing (CMP); ReaxFF reactive force field; Polishing pressure;
CMP behavior of alumina/metatitanic acid core-shell abrasives on sapphire substrates
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); α-Al2O3/TiO(OH)2 core-shell abrasives; Sapphire; Mechanism;
Chemically Assisted Polishing of Monocrystalline Silicon Wafer Si (100) by DDMAF
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical Mechanical Polishing (CMP); Double Disk Magnetic Abrasive Finishing (DDMAF); Magnetic Abrasive Particles (MAP's); Surface roughness;
Investigation of pad wear in CMP with swing-arm conditioning and uniformity of material removal
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); Pad conditioning; Pad profile; Material removal rate (MRR); Within-wafer non-uniformity (WIWNU);
Nd3+-doped colloidal SiO2 composite abrasives: Synthesis and the effects on chemical mechanical polishing (CMP) performances of sapphire wafers
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Nd3+-doped colloidal SiO2 composite abrasives; Chemical mechanical polishing (CMP); Sapphire; Material removal rate (MRR);
Effects of KIO4 concentration and pH values of the solution relevant for chemical mechanical polishing of ruthenium
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Ruthenium; Chemical mechanical polishing (CMP); Potassium periodate (KIO4); Corrosion; Electrochemistry
Effects of non-spherical colloidal silica slurry on Al-NiP hard disk substrate CMP application
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); Non-spherical colloidal silica; Hard disk drive substrate; Surface roughness; Surface defects;
Performance of colloidal silica and ceria based slurries on CMP of Si-face 6H-SiC substrates
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); Silicon carbide (SiC); Silica; Ceria;
Effects of ultra-smooth surface atomic step morphology on chemical mechanical polishing (CMP) performances of sapphire and SiC wafers
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); Sapphire; Silicon carbide (SiC); Atomic step;
XPS, UV-vis spectroscopy and AFM studies on removal mechanisms of Si-face SiC wafer chemical mechanical polishing (CMP)
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Silicon carbide (SiC); Chemical mechanical polishing (CMP); Removal; XPS; UV-vis; Atomic step structure;
Preparation of porous alumina-g-polystyrene sulfonic acid abrasive and its chemical mechanical polishing behavior on hard disk substrate
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); Porous alumina-g-polystyrene sulfonic acid abrasive; Hard disk substrate; Planarization
Experimental investigation of process parameters for roll-type linear chemical mechanical polishing (Roll-CMP) system
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); Linear Roll-CMP; Material removal rate (MRR); Nonuniformity (NU); Copper clad laminate (CCL)
Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing (CMP) processes
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); Material removal rate (MRR); MRR distribution; Modeling;
Preparation of porous alumina abrasives and their chemical mechanical polishing behavior
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); Porous alumina abrasive; Hard disk substrate; Planarization;
Synthesis of non-rigid core–shell structured PS/SiO2 composite abrasives and their oxide CMP performance
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); PS/SiO2 composite abrasives; Core–shell structure; Chemical mechanical polishing (CMP)
Preparation of copper-incorporated mesoporous alumina abrasive and its CMP behavior on hard disk substrate
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); Copper-incorporated mesoporous alumina abrasive; Hard disk substrate; Polishing active element
First observation on the feasibility of scratch formation by pad-particle mixture in CMP process
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); Finite element analysis (FEA); Surface defects; Micro-scratch;
Preparation of silane modified SiO2 abrasive particles and their Chemical Mechanical Polishing (CMP) performances
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical Mechanical Polishing (CMP); Silicon wafer; SiO2
Effects of the ultrasonic flexural vibration on the interaction between the abrasive particles; pad and sapphire substrate during chemical mechanical polishing (CMP)
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Ultrasonic flexural vibration; Chemical mechanical polishing (CMP); Sapphire substrate; Silica abrasive particles; Interaction;
Polishing behavior of PS/CeO2 hybrid microspheres with controlled shell thickness on silicon dioxide CMP
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); PS/CeO2 composite abrasive; Core-shell structure; Shell thickness; Chemical mechanical polishing (CMP);
Polishing behaviors of ceria abrasives on silicon dioxide and silicon nitride CMP
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Ceria; Chemical mechanical polishing (CMP); Grain growth accelerator; Flux method; Sintering process
Preparation of silica/ceria nano composite abrasive and its CMP behavior on hard disk substrate
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); Hard disk substrate; Composite abrasive
Polishing behaviors of single crystalline ceria abrasives on silicon dioxide and silicon nitride CMP
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Ceria; Abrasive; Chemical mechanical polishing (CMP); Removal selectivity
Ultrasonic flexural vibration assisted chemical mechanical polishing for sapphire substrate
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Ultrasonic flexural vibration (UFV); Chemical mechanical polishing (CMP); Sapphire substrate; Material removal rate (MRR); Surface roughness;
XPS study of CMP mechanisms of NiP coating for hard disk drive substrates
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); X-ray photoelectron spectroscope (XPS); Passivation
Adsorption treatment of oxide chemical mechanical polishing wastewater from a semiconductor manufacturing plant by electrocoagulation
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Electrocoagulation; Wastewater treatment; Chemical mechanical polishing (CMP); Adsorption kinetics; Adsorption isotherms; Thermodynamics;
Surface planarization of ZnO thin film for optoelectronic applications
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Zinc oxide (ZnO); Chemical mechanical polishing (CMP); Transmittance; Surface morphology; Optoelectronics
Combined treatment of polishing wastewater and fluoride-containing wastewater from a semiconductor manufacturer
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); Flocculation; Fluoride; Semiconductor; Silica; Wastewater
Chemical evidences for the optimal coagulant dosage and pH adjustment of silica removal from chemical mechanical polishing (CMP) wastewater
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); SiO2(s); Chemical mechanical polishing (CMP); Coagulant dosage; pH; Surface complexation model/surface precipitation model (SCM/SPM);
Silica particles settling characteristics and removal performances of oxide chemical mechanical polishing wastewater treated by electrocoagulation technology
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Electrocoagulation; Wastewater treatment; Turbidity removal; Chemical mechanical polishing (CMP); Silica particles;
Study of COD and turbidity removal from real oxide-CMP wastewater by iron electrocoagulation and the evaluation of specific energy consumption
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Electrocoagulation; Wastewater treatment; COD removal; Chemical mechanical polishing (CMP); Turbidity removal; Specific energy consumption;
A study on the improved performances of OLED using CMP process parameters determined by DOE method
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); Indium–tin oxide (ITO); Organic light emitting diode (OLED); Design of experiment (DOE); Current–voltage (I–V); Photoluminescence spectrum
A study on the chemical mechanical polishing of oxide film using a zirconia (ZrO2)-mixed abrasive slurry (MAS)
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); Mixed abrasive slurry (MAS); Zirconia (ZrO2); Diluted silica slurry (DSS)
Modeling the effects of abrasive size, surface oxidizer concentration and binding energy on chemical mechanical polishing at molecular scale
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); Modeling; Molecular
Chemical mechanical polishing characteristics in (Bi,La)Ti3O12 damascene process for high-density ferroelectric memories
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); (Bi,La)Ti3O12 (BLT); Removal rate; Non-uniformity; Surface roughness;
Platinum chemical mechanical polishing (CMP) characteristics for high density ferroelectric memory applications
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); Platinum (Pt); FeRAM; Electrode
Evaluation of electrical and optical properties of indium tin oxide thin film using chemical mechanical polishing technique
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); Indium tin oxide (ITO); Process parameters; Removal rate; Within-wafer non-uniformity (WIWNU)
Chemical mechanical polishing of BTO thin film for vertical sidewall patterning of high-density memory capacitor
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); Barium titanate (BTO); Patterning; Silica slurry; Selectivity; Vertical sidewall
Chemical mechanical polishing (CMP) mechanisms of thermal SiO2 film after high-temperature pad conditioning
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); Pad conditioning; Hydro-carbonated state; Slurry residues
Characterization of post-copper CMP surface with scanning probe microscopy: Part II: Surface potential measurements with scanning Kelvin probe force microscopy
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); Post-CMP cleaning; Atomic force microscopy
CMP characteristics and optical property of ITO thin film by using silica slurry with a variety of process parameters
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); Indium tin oxide (ITO); Process parameters; Removal rate; Within-wafer non-uniformity (WIWNU%); Optical transmittance
Chemical mechanical polishing and electrochemical characteristics of tungsten using mixed oxidizers with hydrogen peroxide and ferric nitrate
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); Mixed oxidizer; Potentiodynamic polarization; Electrochemical corrosion; Removal rate (RR); Dissolution rate
Characterization of post-copper CMP surfaces with scanning probe microscopy: Part 1: Surface leakage measurement with conductive atomic force microscopy
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Atomic force microscopy (AFM); Surface leakage; Chemical mechanical polishing (CMP); Copper interconnects;
Design of experiment (DOE) method considering interaction effect of process parameters for optimization of copper chemical mechanical polishing (CMP) process
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); Copper; Design of experiment (DOE); Interaction effect; Turntable speed; Head speed; Back pressure; Down force; Removal rate; Non-uniformity; Edge to center (ETC)
Effect of slurry pH on the defects induced during the plug isolation chemical mechanical polishing
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Micro dishing; Slurry; Chemical mechanical polishing (CMP);
The relationship between wafer surface pressure and wafer backside loading in Chemical Mechanical Polishing
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical Mechanical Polishing (CMP); Pressure distribution; Backside loading;
Effects of conditioning temperature on polishing pad for oxide chemical mechanical polishing process
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); Pad conditioning; Groove; Pore; Viscoelastic property;
Effects of oxidant additives for exact selectivity control of W- and Ti-CMP process
Keywords: ماشینکاری مکانیکی شیمیایی (CMP); Chemical mechanical polishing (CMP); Oxidant; Polishing selectivity; Passivation layer;