Effects of the ultrasonic flexural vibration on the interaction between the abrasive particles; pad and sapphire substrate during chemical mechanical polishing (CMP)

▶ The actions of the ultrasonic and silica abrasive particles were the main factors in the sapphire material removal rate (MMR). ▶ The chemical additives were helpful to decrease the roughness of sapphire. ▶ The effects of the flexural vibration on the interaction between the silica abrasive particles, pad and sapphire substrate improved the sapphire's MRR.