Effects of non-spherical colloidal silica slurry on Al-NiP hard disk substrate CMP application

- Spherical and non-spherical colloidal silica particle size and shape were characterized.
- Non-spherical colloidal silica slurry exhibits higher MRR during CMP.
- Wide PSD of non-spherical colloidal silica slurry can further increase MRR.
- Non-spherical colloidal silica and conventional alumina-silica slurry were compared.
- Lower surface roughness and lower surface defects with no TA embedded alumina.