کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
10628517 | 990384 | 2005 | 11 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Rate control for copper tarnishing
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Rate control for copper tarnishing Rate control for copper tarnishing](/preview/png/10628517.png)
چکیده انگلیسی
The reduction of copper sulphide and copper oxides originated during artificial tarnishing of copper is studied using potentiodynamic potential/current density experiments. Six copper surface treatments are considered: mechanical polishing; indoor exposure for 7 days; chemical etching in 1.6 M nitric acid; chemical etching and heating at 160 °C; and chemical etching and dipping in a 9 Ã 10â4 M or 0.9 M potassium sulphide (K2S) solution at 70 °C. Cuprite (Cu2O) and chalcocite (Cu2S) are the main compounds formed. A linear relationship with the square root of the scan rate (ν) is obtained by plotting the potentiodynamic potential/current density for the tarnish dissolution processes. A relationship between potential and current density cathodic peaks is not obtained, according to Müller's model, showing a proportionality factor with the dimensions of a resistance.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Corrosion Science - Volume 47, Issue 4, April 2005, Pages 977-987
Journal: Corrosion Science - Volume 47, Issue 4, April 2005, Pages 977-987
نویسندگان
E. Cano, J.L. Polo, A. La Iglesia, J.M. Bastidas,