کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
10634066 | 993305 | 2012 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints](/preview/png/10634066.png)
چکیده انگلیسی
The strain-rate-dependent mechanical behavior of Sn-rich solder is of fundamental importance. Dynamic solder joint strength is hypothesized to be controlled by two factors. At low strain rates it is believed to be controlled by the bulk solder and at high strain rates by the brittle intermetallic layer. In this paper, the dynamic solder joint strength of Sn-3.9Ag-0.7Cu solder joints was experimentally quantified to verify the solder and intermetallic compound-controlled behavior hypothesis.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Scripta Materialia - Volume 66, Issue 8, April 2012, Pages 586-589
Journal: Scripta Materialia - Volume 66, Issue 8, April 2012, Pages 586-589
نویسندگان
K.E. Yazzie, H.X. Xie, J.J. Williams, N. Chawla,