Microstructure and mechanical properties of low Ga content Sn-8.55Zn-0.5Ag-0.1Al-xGa solders

The Sn-8.5Zn-0.5Ag-0.1Al-xGa solders were investigated. The results showed that the microstructure of the solders were eutectic. The addition of Ga dramatically decreased the melting point of solders. Notably, the increase in Ga content of the solder improved the solderability, the tensile strength and reduced the ductility.