Creep behavior of near-peritectic Sn-5Sb solders containing small amount of Ag and Cu

▶ We add small amount of Ag and Cu into the Sn-5Sb solder alloy. ▶ We examine changes in the microstructure and creep properties of the solder alloys. ▶ The Sn-5Sb-0.7Cu solder alloy shows the highest creep resistance compared with the other two alloys. ▶ The presence of hard Cu6Sn5 and fine SbSn IMCs in the Sn-5Sb-0.7Cu alloy increased the resistance to dislocation movement, and improved the creep properties.