The preparation and performance of a novel room-temperature-cured heat-resistant adhesive for ceramic bonding

▶ A novel adhesive was made using silicon-epoxy IPNs, B4C, etc. ▶ Satisfactory bonding strength 9.44 MPa was achieved at high temperature. ▶ The adhesive had good heat-resistance property with 10% weight loss at 435 °C. ▶ Failure mode of joint was mixing failure due to the high chemical bonding force.