کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
10666251 | 1007651 | 2005 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Interfacial reactions in 3D-SiC network reinforced Cu-matrix composites prepared by squeeze casting
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
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چکیده انگلیسی
Copper matrix composites reinforced with 3D-silicon carbide network were prepared by squeeze casting process at 1150 °C. The interfacial reaction during preparation was studied by means of energy-dispersive X-ray spectroscopy analyzer (XEDS) attached to scanning electron microscope (SEM), X-ray diffractometry (XRD), transmission electron microscope (TEM) and analytical electron microscope (AEM). This study revealed that silicon in the 3D-SiC network reacted with copper producing Cu3Si, while SiC itself did not react with copper under the experiment conditions. The shape of present Cu3Si was mainly lathy distribution in the composites and some cracks were found in it. Avoiding remnants silicon of the 3D-SiC network could prevent from the reaction of Cu3Si.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Letters - Volume 59, Issue 12, May 2005, Pages 1563-1566
Journal: Materials Letters - Volume 59, Issue 12, May 2005, Pages 1563-1566
نویسندگان
Hongwei Xing, Xiaoming Cao, Wanping Hu, Longzhi Zhao, Jinsong Zhang,