Electroless copper coating on nickel foils in super-gravity field

This paper reports the study of super-gravity effects on electroless copper coating on nickel substrate. The plating rates were obtained versus varying super-gravity accelerations and two super-gravity directions by thickness measurement of Cu coating. Composition and morphology of the coating were measured by XRD and SEM analysis. The use of super-gravity field during electroless copper plating can increase the plating rate and enlarge the size of Cu crystal grain. Coating surface vertical to super-gravity can obtain better coating than in position whose surface parallel to super-gravity.