A comparative study of nanocrystalline Cu film deposited using anodic vacuum arc and dc magnetron sputtering

► AVA deposition rate is much higher than that of sputter deposition. ► AVA-deposited Cu films possess smaller crystallites than dc-sputtered ones. ► AVA deposited films having thickness less than 100 nm are more resistive. ► AVA deposited Cu films show lower temperature coefficient of resistance. ► The change in thermoelectric power w.r.t. Cu bulk is higher in AVA deposited films.