Electrically insulating, layer structured SiR/GNPs/BN thermal management materials with enhanced thermal conductivity and breakdown voltage

Layer structured high-performance thermal management materials via integrating the advantages of boron nitride (BN, electrically insulating) and graphene nanoplatelets (GNPs, highly thermally conductive) as fillers were realized by a facile and scalable strategy. Outstanding thermal conductivity (TC) of 8.45 W m−1 K−1, the highest value among reported electrically insulating polymer-based materials, excellent electrical insulation (breakdown voltage∼5.33 kV/mm; volume resistance ∼1012Ωcm) and superior electromagnetic interface shielding performance are achieved at a filler loading of 17.88 vol%. Moreover, the mechanical properties and hardness are also in quite good range. Thus, a promising method is provided for large scale production of superior thermal management materials.