کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1459599 989595 2016 5 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Slow crack growth behavior of silicon nitride ceramics in cryogenic environment
ترجمه فارسی عنوان
رفتار رشد تدریجی ترک سیلیکون نیترید سرامیک در محیط فریزر
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد سرامیک و کامپوزیت
چکیده انگلیسی

The slow crack growth behavior of Si3N4 ceramics in ambient and cryogenic environment had been investigated by dynamic fatigue testing. The fracture strength was principally dependent on stress rate at 293 K while the fracture strength was comparatively independent of stress rate at 77 K. The morphologies of the fracture surface and the crack tip region were examined to correlate with the slow crack growth behavior. The experimental results revealed that the Si3N4 ceramics exhibits a very high resistance to slow crack growth (SCG) in cryogenic environment. The reasons for such high resistance are likely related to the local residual stress associated with either the thermal anisotropies arising from the presence of the grain boundary glass phase, or from the crack tip shielding mechanism.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Ceramics International - Volume 42, Issue 2, Part B, 1 February 2016, Pages 3687–3691
نویسندگان
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