Alumina–copper joining by the sintered metal powder process

Sintered metal powder process (SMPP) is one of the high technology methods in ceramic–metal joining domain. The present study examines the effect of temperature and time of metalized layer sintering on the thickness and homogeneity of the joining layer, the leakage rate in alumina–copper joining zone, and also identifies the different phases formed during sintering. The samples were characterized by optical microscopy (OM), scanning electron microscopy (SEM) and energy dispersion spectroscopy (EDS). Microstructure studies indicate that sintering the metalized layer with a holding time of 90 min at the temperature of 1530 °C, and with an applied layer thickness of 50 μm with proper plating and brazing stages lead to a completely homogeneous joining zone with an adequate thickness (about 33 μm). The results of leak tests on alumina–copper specimen in this condition was less than 10−9 Pa l s−1.