Electrochemical evaluation of allyl thiourea layers on copper surface

Self-assembled monolayers (SAMs) derived from adsorption of allyl thiourea onto the surface of copper in ethanol solution were evaluated in neutral aqueous sodium chloride solutions. The electrochemical behaviors and anticorrosion features of copper in the presence of allyl thiourea in neutral aqueous sodium chloride solutions were investigated by using electrochemical techniques. SAMs of allyl thiourea against copper corrosion hinder the copper oxide formation. Protective properties of allyl thiourea layers on copper surfaces depend on the applied potential, the concentration of allyl thiourea and the chloride ions in the environment. These findings should be taken into account for the use of allyl thiourea.