Effect of low copper content and heat treatment on intergranular corrosion of model AlMgSi alloys

Certain 6000-series extrusions may develop susceptibility to intergranular corrosion (IGC) by improper heat treatment, especially if copper is present as an alloying element. Although occurrence of IGC in such cases is documented, the underlying mechanisms are not adequately explained. We present corrosion data for two model alloys, having different Cu content and Mg:Si ratio, showing that the susceptibility to IGC depended primarily on the Cu content and secondly on thermal processing. Low Cu samples (0.0005 wt.% Cu) were essentially resistant to IGC. High Cu samples (0.12 wt.% Cu), which were air cooled after extrusion, exhibited significant IGC. However, IGC susceptibility was reduced significantly as a result of artificial aging to peak strength. Water quenched high Cu samples were essentially resistant to IGC. However, slight IGC susceptibility was introduced after aging. Electron optical characterisation revealed Al4Mg8Si7Cu2 (Q-phase) grain boundary precipitates on all the variants susceptible to IGC. The susceptibility was attributed to microgalvanic coupling between Q-phase grain boundary precipitates (noble) and the adjacent depleted zone (active).