کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
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1491025 | 992340 | 2010 | 4 صفحه PDF | دانلود رایگان |
![عکس صفحه اول مقاله: Corrosion protection of ENIG surface finishing using electrochemical methods Corrosion protection of ENIG surface finishing using electrochemical methods](/preview/png/1491025.png)
Four types of thin film coating were carried out on copper for electronic materials by the electroless plating method at a pH range from 3 to 9. The coating performance was evaluated by electrochemical impedance spectroscopy and potentiodynamic polarization testing in a 3.5 wt.% NaCl solution. In addition, atomic force microscopy and X-ray diffraction were also used to analyze the coating surfaces. The electrochemical behavior of the coatings was improved using the electroless nickel plating solution of pH 5. The electroless nickel/immersion gold on the copper substrate exhibited high protective efficiency, charge transfer resistance and very low porosity, indicating an increase in corrosion resistance. Atomic force microscopy and X-ray diffraction analyses confirmed the surface uniformity and the formation of the crystalline-refined NiP {1 2 2} phase at pH 5.
Journal: Materials Research Bulletin - Volume 45, Issue 3, March 2010, Pages 305–308