کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1498315 | 1510899 | 2015 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Current-assisted direct Cu/Cu joining
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
سرامیک و کامپوزیت
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چکیده انگلیسی
Enhanced direct Cu/Cu joining by applying current was investigated. Joining was conducted at 240–300 °C for 10–50 min under 40 MPa. Current was applied to Cu wire during joining. Contact resistance of joints decreased and the fracture load of joints increased as the current increased. The joined region increased and the interface became less straight as the current increased. These results are ascribed to electromigration and joule heating effects. The enhanced diffusion contributed significantly to the joining of metals.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Scripta Materialia - Volume 104, 15 July 2015, Pages 21–24
Journal: Scripta Materialia - Volume 104, 15 July 2015, Pages 21–24
نویسندگان
Chanho Shin, Sung Woo Ma, Jeong Hwan Lee, Ki Bum Kim, Minsuk Suh, Namseog Kim, Young-Ho Kim,