کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1499541 993311 2012 4 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
In situ tensile creep behaviors of Sn–4Ag/Cu solder joints revealed by electron backscatter diffraction
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
In situ tensile creep behaviors of Sn–4Ag/Cu solder joints revealed by electron backscatter diffraction
چکیده انگلیسی

In this study, the in situ tensile creep behaviors of Sn–4Ag/Cu solder joints were observed, and microstructural evolutions of the solder during the deformation processes were characterized by electron backscatter diffraction. The results reveal that slow plastic deformation or grain rotation occurs inside different solder grains, depending on their orientations and distance from the joint interface. When the strain increases to a certain extent, dynamic recovery occurs inside some solder grains, resulting in polygonization and grain subdivision.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Scripta Materialia - Volume 67, Issue 3, August 2012, Pages 289–292
نویسندگان
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