کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1499751 993320 2011 4 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Electromigration stress induced deformation mechanisms in free-standing platinum thin films
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
Electromigration stress induced deformation mechanisms in free-standing platinum thin films
چکیده انگلیسی

We present experimental evidence of anomalously high grain boundary mobility in 3–5 nm grain size platinum films at near room temperature. This mobility can be explained in terms of the localized electromigration stresses of the order of a few GPa that we observed. In the absence of conventional deformation mechanisms, the stress is relaxed through rapid grain growth up to a grain size of 40 nm. For larger grain sizes, grain boundary mobility is reduced as the stresses are relaxed by grain rotation and dislocation-based deformation mechanisms.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Scripta Materialia - Volume 65, Issue 4, August 2011, Pages 277–280
نویسندگان
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