Low-frequency damping properties of eutectic Sn–Bi and In–Sn solders

Eutectic Sn–Bi and In–Sn solders possess much higher damping capacities than Sn–Ag–Cu solders at temperatures above room temperature. The strain amplitude dependence of damping capacities in Sn–Bi solder determined at room temperature is comparable to that of Mg alloys measured at the same temperature. Sn–Bi and In–Sn solders both exhibit conspicuous high-temperature damping backgrounds, with activation energies of 0.77 and 0.27 eV, respectively.

Research highlights
► Eutectic Sn–Bi and In–Sn solders possess much higher damping capacities than Sn–Ag–Cu solders at temperatures above room temperature.
► Sn–Bi and In–Sn solders both exhibit conspicuous HTDBs with activation energies of 0.77 and 0.27 eV, respectively.