Phase transformation of single crystal silicon induced by grinding with ultrafine diamond grits

Phase transformation of single crystal silicon (Si) was investigated under various grinding conditions using high-resolution transmission electron microscopy. Nanocrystals with sizes ranging from 6 to 20 nm of diamond cubic silicon (Si-I) and high-pressure phase (Si-III) were observed in the grinding-induced amorphous Si layers. The phase transformation pattern was found to be influenced by the thermal status involved in the grinding processes.