Titanium interlayers as adhesion promoters for SiCf/Cu composites

An SiCf–Ti–Cu composite was fabricated by the foil–fiber–foil method. Tensile tests show that the tensile strength of this composite is much higher than that of Cu–Ti matrix. The adhesion of the SiCf/Ti interface is excellent. The reaction zone of the Ti/Cu interface is composed of four layers – CuTi2, CuTi, Cu4Ti3 and Cu4Ti – and the debonding between Ti foil and Cu foil mainly occurred between the CuTi and Cu4Ti3 reaction layers.