کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1501817 | 993396 | 2010 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Growth kinetics and size distribution of intermetallic compound grains in soldering reaction based on separate measurements of grain radius and height
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
A phase-field simulation was employed to estimate the kinetics and size distribution of the intermetallic compound grains in terms of separately measured grain radius and height. The grain height was rather uniform and had a distribution curve with a narrow sharp peak, not following the grain radius distribution only slightly deviated from the flux-driven ripening model. It was also demonstrated that the cross-sectional grain height was smaller and had a broader distribution than the actual grain height.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Scripta Materialia - Volume 62, Issue 1, January 2010, Pages 29–32
Journal: Scripta Materialia - Volume 62, Issue 1, January 2010, Pages 29–32
نویسندگان
Hee-Soo Kim, Yong Sun Won, Young Hoon Kwak,