کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1502073 993405 2007 4 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Grain boundary doping of Cu thin films with Bi: A route to create smooth and stable nanocrystalline surfaces
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
Grain boundary doping of Cu thin films with Bi: A route to create smooth and stable nanocrystalline surfaces
چکیده انگلیسی

The thermodynamic and kinetic properties of grain boundaries fundamentally influence the smoothness and stability of nanostructured interfaces. Using nanocrystalline Cu thin films as a model system, we address these issues by alloying small amounts of Bi, ranging from 0.1 to 1.0 at.%, during co-deposition from vapor, followed by subsequent annealing treatments. Stabilization of Bi-rich nanocrystalline layers in surface and substrate regions is observed at Bi concentrations as low as 0.5%, accompanied by minimum surface roughness, while lower Bi concentrations allow for partial coarsening.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Scripta Materialia - Volume 57, Issue 9, November 2007, Pages 853–856
نویسندگان
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