Creep in nanocrystalline Ni during X-ray diffraction

Stress-dip experiments followed by creep have been performed on nanocrystalline Ni during in situ X-ray diffraction. The signatures of the peak profile at different creep stress levels demonstrate the presence of a creep mechanism that broadens the diffraction peak width and of a creep mechanism that reduces the peak width. The balance between the two mechanisms is discussed in terms of the applied creep stress.