کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1503604 993489 2007 4 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Suppressing Ni–Sn–P growth in SnAgCu/Ni–P solder joints
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
Suppressing Ni–Sn–P growth in SnAgCu/Ni–P solder joints
چکیده انگلیسی

The interfacial morphologies for SnAgCu/Ni–P with various phosphorous contents were investigated by electron microscopy. The initial formation of the phosphorous-rich phase in Ni–P under-bump metallizations (UBMs) was dependent on phosphorous content, i.e., Ni3P for Ni–7 wt.%P UBM and Ni12P5 for Ni–13 wt.%P UBM. Different NixPy phases significantly affected the subsequent Ni–Sn–P formation. The growth of Ni–Sn–P could be thus controlled by altering the phosphorous content of the Ni–P UBMs. Therefore, an approach to suppress Ni–Sn–P formation is proposed.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Scripta Materialia - Volume 56, Issue 1, January 2007, Pages 49–52
نویسندگان
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