کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1503657 | 993495 | 2006 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Electromigration effect on solder bump in Cu/Sn–3Ag–0.5Cu/Cu system
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Electromigration effect on solder bump in Cu/Sn–3Ag–0.5Cu/Cu system Electromigration effect on solder bump in Cu/Sn–3Ag–0.5Cu/Cu system](/preview/png/1503657.png)
چکیده انگلیسی
The electromigration effect on solder bump and interfacial reactions in the Cu/Sn–3Ag–0.5Cu/Cu flip chip joint was investigated at 453 K with 10 kA/cm2. Cu was transported towards the anode and avoid nucleated at the highest current density point near the cathode. The void nucleated at the Sn/Cu6Sn5 interface and grew along the cathode side. It was observed that the unique solder bump deformation towards the cathode started in the early stage of the electromigration test.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Scripta Materialia - Volume 55, Issue 10, November 2006, Pages 867–870
Journal: Scripta Materialia - Volume 55, Issue 10, November 2006, Pages 867–870
نویسندگان
Kimihiro Yamanaka, Yutaka Tsukada, Katsuaki Suganuma,